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The USB-IF used WiGig Serial Extension v1.2 specification as its initial foundation for the MA-USB specification and is compliant with SuperSpeed USB (3.0 and 3.1) and Hi-Speed USB (USB 2.0). Devices that use MA-USB will be branded as "Powered by MA-USB", provided the product qualifies its certification program. [110]
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
The USB 3.0 Micro-B plug effectively consists of a standard USB 2.0 Micro-B cable plug, with an additional 5 pins plug "stacked" to the side of it. In this way, cables with smaller 5 pin USB 2.0 Micro-B plugs can be plugged into devices with 10 contact USB 3.0 Micro-B receptacles and achieve backward compatibility.
The xHCI reduces the need for periodic device polling by allowing a USB 3.0 or later device to notify the host controller when it has data available to read, and moves the management of polling USB 2.0 and 1.1 devices that use interrupt transactions from the CPU-driven USB driver to the USB host controller.
In April 2015, Samsung's Galaxy S6 family was the first phone to ship with eUFS storage using the UFS 2.0 standard. [21] On 7 July 2016, Samsung announced its first UFS cards, in 32, 64, 128, and 256 GB storage capacities. [22] The cards were based on the UFS 1.0 Card Extension Standard.
The physical phenomena on which the device relies (such as spinning platters in a hard drive) will also impose limits; for instance, no spinning platter shipping in 2009 saturates SATA revision 2.0 (3 Gbit/s), so moving from this 3 Gbit/s interface to USB 3.0 at 4.8 Gbit/s for one spinning drive will result in no increase in realized transfer rate.