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Plasma etching can change the surface contact angles, such as hydrophilic to hydrophobic, or vice versa. Argon plasma etching has reported to enhance contact angle from 52 deg to 68 deg, [7] and, Oxygen plasma etching to reduce contact angle from 52 deg to 19 deg for CFRP composites for bone plate applications. Plasma etching has been reported ...
The plasma produces energetic free radicals, neutrally charged, that react at the surface of the wafer. Since neutral particles attack the wafer from all angles, this process is isotropic. Plasma etching can be isotropic, i.e., exhibiting a lateral undercut rate on a patterned surface approximately the same as its downward etch rate, or can be ...
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JPEG loss less is a tool to transform the images without loss in quality due to compression. MPEG encoder is a tool for converting a series of images into a diashow-style MPEG file. RAW image converter , is a conversion tool for raw format images.
Plasma processing is a plasma-based material processing technology that aims at modifying the chemical and physical properties of a surface. [1] Plasma processing techniques include: Plasma activation; Plasma ashing; Plasma cleaning; Plasma electrolytic oxidation; Plasma etching; Plasma functionalization; Plasma polymerization; Corona treatment ...
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure by an electromagnetic field.