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The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...
Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
The plant's major product was bottles. [21] Raw materials for the glass were continuously fed into the furnace, and the melting was continuous. The glass made using this methodology could be only one color. [38] Natural gas for melting glass: Natural gas began being used in the United States to melt glass batch during the early 1880s. [39]
Glass polishing may refer to: the fine grinding of glass by abrasives to produce smooth surfaces or for artistic purposes the cleaning of the surfaces of glass objects to rid them of dirt, fingerprints, etc.
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
The “Cooking With Paris” star turns up the heat with a pink-tastic new cookware line for Walmart. ... (The “That’s Hot” cup is already sold out.) It’s a range of more than 20 products ...