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The optimal humidity for electronic devices is 30% to 65%. At the top end of the range, moisture may increase the conductivity of permeable insulators leading to malfunction. Too low humidity may make materials brittle. A particular danger to electronic items, regardless of the stated operating humidity range, is condensation.
An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating ...
IEC 60068 is an international standard for the environmental testing of electrotechnical products that is published by the International Electrotechnical Commission (IEC).. IEC 60068 is a collection of methods [1] for environmental testing of electronic equipment and products to assess their ability to perform under environmental conditions including extreme cold and dry heat.
Moisture sensitivity level (MSL) is a rating that shows a device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering as defined in J-STD-020. It relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device ...
v. t. e. A hygrometer is an instrument which measures the humidity of air or some other gas: that is, how much water vapor it contains. [1] Humidity measurement instruments usually rely on measurements of some other quantities such as temperature, pressure, mass, and mechanical or electrical changes in a substance as moisture is absorbed.
Humidity and aggressive chemicals can cause corrosion of the packaging materials and leads, potentially breaking them and damaging the inside parts, leading to electrical failure. Exceeding the allowed environmental temperature range can cause overstressing of wire bonds, thus tearing the connections loose, cracking the semiconductor dies, or ...