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Similar to design for manufacture (DFM) and design for assembly (DFA) (which seek to avoid designs which are difficult to make), the concept of DFI considers measurement capabilities at an early stage in the product development life cycle and uses knowledge of the fundamental principles of metrology to achieve cost reduction. If the inspection ...
In many fields (e.g., very-large-scale integration (VLSI) and nanoelectronics) X may represent several traits or features including: manufacturability, power, variability, cost, yield, or reliability. [5] This gives rise to the terms design for manufacturability (DfM, DFM), design for inspection (DFI), design for variability (DfV), design for ...
Inspection is a major component of quality control, where physical product is examined visually (or the end results of a service are analyzed). Product inspectors will be provided with lists and descriptions of unacceptable product defects such as cracks or surface blemishes for example.
VLSI Test Principles and Architectures, by L.T. Wang, C.W. Wu, and X.Q. Wen, Chapter 2, 2006. Elsevier. Electronic Design Automation For Integrated Circuits Handbook, by Lavagno, Martin and Scheffer, ISBN 0-8493-3096-3 A survey of the field of electronic design automation. This summary was derived (with permission) from Vol I, Chapter 21 ...
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Computer-aided inspection (CAI) is the use of software tools to assess manufactured objects. [ 1 ] [ 2 ] It is closely related to computer-aided design (CAD) and computer-aided manufacturing (CAM). Its primary purpose is to allow engineers to more quickly and precisely assess the physical properties of manufactured objects.
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Inspection and measurement of the thickness of the different layers of an electronic chip using THz and X-ray radiation. THz has the privilege of being non-ionizing (non-destructive) but the resolution of X-ray is higher. [2] Quality related in-process inspection/verification is an essential part of quality control in manufacturing.