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A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board. The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15. The number is sometimes followed by a letter, indicating that components are grouped or matched with ...
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
Printed circuit board of a DVD player. Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and some electronic components mounted using through-hole mounting. A printed circuit board (PCB), also called printed wiring board (PWB), is a medium ...
Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the ...
The Gerber format is an open, ASCII, vector format for printed circuit board (PCB) designs. [1] It is the de facto standard used by PCB industry software to describe the printed circuit board images: copper layers, solder mask, legend, drill data, etc. [2] [3] [4] The standard file extension is .GBR or .gbr [1] though other extensions like .GB, .geb or .gerber are also used.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...
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