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Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
By spraying the photoresist onto the surface of the wafer as opposed to spin coating the photoresist, a lot of photoresist is saved, and smaller and more precise parts can be made. Spray coating is still in its development phase and much more research needs to be done to make it cost effective and applicable.
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronics industry .
The wafer is covered with photoresist liquid by spin coating. Thus, the top layer of resist is quickly ejected from the wafer's edge while the bottom layer still creeps slowly radially along the wafer. In this way, any 'bump' or 'ridge' of resist is removed, leaving a very flat layer.
The photoresist is removed in the areas, where the target material is to be located, creating an inverse pattern.) Target material (usually a thin metal layer) is deposited (on the whole surface of the wafer). This layer covers the remaining resist as well as parts of the wafer that were cleaned of the resist in the previous developing step.
SU-8 molecule. SU-8 is a commonly used epoxy-based negative photoresist.Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development.
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The standard process (compare to figure "Schematic bonding process") consists of applying SU-8 on the top wafer by spin-on or spray-on of thin layers (3 to 100 μm). Subsequently, the structuring of the photo-resist using direct UV light exposure is applied but can also be achieved through deep reactive-ion etching (DRIE). During coating and ...