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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...

  3. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead. Surface-mount capacitor A MOSFET, placed upon a British postage stamp for size comparison.

  4. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    These handling difficulties prompted development of alternative SMT packages for common MELF components (like diodes) where the power handling capability needed to be similar to MELF components (superior to low-power 0805/0603, etc. SMT components) but with improved automated pick-and-place handling characteristics. [3]

  5. Ceramic capacitor - Wikipedia

    en.wikipedia.org/wiki/Ceramic_capacitor

    The minimum thickness of the dielectric layer, which today (2013) for low voltage capacitors is in the size range of 0.5 micrometers [3] is limited downwards by the grain size of the ceramic powder. The thickness of the dielectric for capacitors with higher voltages is determined by the dielectric strength of the desired capacitor.

  6. NEMA size - Wikipedia

    en.wikipedia.org/wiki/NEMA_size

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  7. Small outline integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Small_Outline_Integrated...

    The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP, [citation needed] thereby expanding the margin of operating parameters. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications.

  8. Contact pad - Wikipedia

    en.wikipedia.org/wiki/Contact_pad

    Gold wire ball-bonded to a gold contact pad. Contact pads or bond pads are small, conductive surface areas of a printed circuit board (PCB) or die of an integrated circuit. They are often made of gold, copper, or aluminum and measure mere micrometres wide. Pads are positioned on the edges of die, to facilitate connections without shorting.

  9. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.