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The wearing course, also known as a friction course or surface course, is the upper layer in roadway, airfield, and dockyard construction. The term 'surface course' is sometimes used slightly different, to describe very thin surface layers such as chip seal. In rigid pavements the upper layer is a portland cement concrete slab.
An SOI MOSFET is a metal–oxide–semiconductor field-effect transistor (MOSFET) device in which a semiconductor layer such as silicon or germanium is formed on an insulator layer which may be a buried oxide (BOX) layer formed in a semiconductor substrate.
Bond course: This is a course of headers that bond the facing masonry to the backing masonry. [1] Plinth: The bottom course of a wall. String course (Belt course or Band course): A decorative horizontal row of masonry, narrower than the other courses, that extends across the façade of a structure or wraps around decorative elements like columns.
The base course or basecourse in pavements is a layer of material in an asphalt roadway, race track, riding arena, or sporting field. It is located under the surface layer consisting of the wearing course and sometimes an extra binder course. If there is a sub-base course, the base course is constructed directly above this layer.
Doped metal oxides for use as transparent conducting layers in photovoltaic devices are typically grown on a glass substrate. This glass substrate, apart from providing a support that the oxide can grow on, has the additional benefit of blocking most infrared wavelengths greater than 2 μm for most silicates, and converting it to heat in the glass layer.
Indium tin oxide (ITO) is an optoelectronic material that is applied widely in both research and industry. ITO can be used for many applications, such as flat-panel displays, smart windows, polymer-based electronics, thin film photovoltaics, glass doors of supermarket freezers, and architectural windows.
Anodic bonding on silicon substrates is divided into bonding using a thin sheet of glass (a wafer) or a glass layer that is deposited onto the silicon using a technique such as sputtering. The glass wafer is often sodium-containing Borofloat or Pyrex glasses. With an intermediate glass layer, it is also possible to connect two silicon wafers. [6]
Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces.