Search results
Results From The WOW.Com Content Network
Core Ultra 200H and 200HX series mobile processors will follow in early 2025. [2] Arrow Lake desktop CPUs integrated Thunderbolt 4 and USB4 in the CPU, which allowed it to not waste PCIe 3 lanes and use simple retimers instead. The chipset has the same maximum 5 integrated USB 3.2 2x2, and is Thunderbolt 5 ready if discrete board is used. [3]
Two AMD Ryzen 9000 series microprocessors with Zen 5 architecture. Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4]
The Standard Performance Evaluation Corporation (SPEC) is a non-profit consortium that establishes and maintains standardized benchmarks and performance evaluation tools for new generations of computing systems. SPEC was founded in 1988 and its membership comprises over 120 computer hardware and software vendors, educational institutions ...
The 2025 Evolution Championship Series will be held at the Las Vegas Convention Center in Winchester, Nevada. [9] September 25–28 Tokyo Game Show 2025 will be held in the Makuhari Messe, in Chiba, Japan. [citation needed] December 11 The Game Awards 2025 is scheduled to be held at the Peacock Theater in Los Angeles. [10]
Geekbench began as a benchmark for Mac OS X and Windows, [3] and is now a cross-platform benchmark that supports macOS, Windows, Linux, Android and iOS. [4] In version 4, Geekbench started measuring GPU performance in areas such as image processing and computer vision. [5] In version 5, Geekbench dropped support for IA-32. [6]
enhanced McKinley microarchitecture used in the Itanium 2 9000- and 9100-series of processors. Added dual core, coarse multithreading, and other improvements. The Montvale update added demand-based switching and core-level lockstep execution. Tukwila enhanced microarchitecture used in the Itanium 9300 series of processors.
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.