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Electroless nickel-boron coating (often called NiB coating) is a metal plating process that can create a layer of a nickel-boron alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a boron-containing reducing agent , such as an ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless nickel-phosphorus coatings with less than 7% phosphorus are solid solutions with a microcrystalline structure, with each grain 2–6 nm across. Coatings with more than 10% phosphorus are amorphous. Between these two limits, the coating is a mixture of amorphous and microcrystalline materials. [16]
Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2 −) (or a borohydride-like compound) as a reducer. [6] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:
Electroless processes are widely used to deposit nickel-phosphorus or nickel-boron alloys for wear and corrosion resistance, silver for mirror-making, copper for printed circuit boards, and many more. A major advantage of these processes over electroplating is that they can produce coatings of uniform thickness over surfaces of arbitrary shape ...
Nickel plating may refer to: . Nickel electroplating, a technique of electroplating a thin layer of nickel onto a metal object; Electroless nickel-phosphorus plating, an auto-catalytic chemical technique used to deposit a layer of nickel-phosphorus on a solid workpiece
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