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Image of flexible printed circuits prior to de-panelization. An Olympus Stylus camera without the case, showing the flex circuit assembly. Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic components on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester [1] film.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
Unimicron Technology Corporation (Unimicron; TWSE: 3037) is a printed circuit board (PCB) manufacturer headquartered in Taiwan. The company produces PCBs, high density interconnection (HDI) boards, flexible PCBs, rigid flex PCBs, integrated circuit (IC) carriers, and others. In addition, it provides testing and burn-in services of IC substrates ...
In the simplest case, stretchable electronics can be made by using the same components used for rigid printed circuit boards, with the rigid substrate cut (typically in a serpentine pattern) to enable in-plane stretchability. [1] However, many researchers have also sought intrinsically stretchable conductors, such as liquid metals. [2]
Minco is a privately owned company with over 650 employees worldwide. Based in Fridley, Minnesota, the company designs and manufactures flexible printed circuit boards and interconnects, RTD based temperature sensors and assemblies, and thermal solutions for medical, defense, aerospace, industrial, and food service applications.
Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards (PCBs) and populating them with electronic components. It involves the full assembly of a board into a functional circuit board. In board manufacturing, multiple PCBs are grouped on a single panel for efficient processing.
The designers behind the LTE/386s made heavy use of rigid-flex interconnects between the different printed circuit boards in order to save weight and reduce the amount of fragile wires and cables needed to communicate between different components and boards.
A common example of an interposer is an integrated circuit die to BGA, such as in the Pentium II. This is done through various substrates, both rigid and flexible, most commonly FR4 for rigid, and polyimide for flexible. [1] Silicon and glass are also evaluated as an integration method.