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A double-gate FinFET device. A fin field-effect transistor (FinFET) is a multigate device, a MOSFET (metal–oxide–semiconductor field-effect transistor) built on a substrate where the gate is placed on two, three, or four sides of the channel or wrapped around the channel (gate all around), forming a double or even multi gate structure.
In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.
In October 2019, TSMC reportedly started sampling 5 nm A14 processors for Apple. [22] At the 2020 IEEE IEDM conference, TSMC reported their 5 nm process had 1.84x higher density than their 7nm process. [23] At IEDM 2019, TSMC revealed two versions of 5 nm, a DUV version with a 5.5-track cell, and an (official) EUV version with a 6-track cell.
FinFET: Digh Hisamoto, Toru Kaga, Yoshifumi Kawamoto, Eiji Takeda Hitachi Central Research Laboratory [57] [58] [59] December 1998: 17 nm: FinFET Digh Hisamoto, Chenming Hu, Tsu-Jae King Liu, Jeffrey Bokor: University of California (Berkeley) [60] [61] 2001 15 nm: FinFET Chenming Hu, Yang-Kyu Choi, Nick Lindert, Tsu-Jae King Liu: University of ...
In 1998, the team developed the first N-channel FinFETs and successfully fabricated devices down to a 17 nm process. The following year, they developed the first P-channel FinFETs. [12] They coined the term "FinFET" (fin field-effect transistor) in a December 2000 paper. [13] In current usage the term FinFET has a less precise definition.
Julius Edgar Lilienfeld, who proposed the concept of a field-effect transistor in 1925.. The concept of a field-effect transistor (FET) was first patented by the Austro-Hungarian born physicist Julius Edgar Lilienfeld in 1925 [1] and by Oskar Heil in 1934, but they were unable to build a working practical semiconducting device based on the concept.
The Raufoss Mk 211 is a .50 BMG (12.7×99mm NATO) multi-purpose anti-material high-explosive incendiary/armor-piercing ammunition projectile produced by Nammo under the model name NM140 MP. [1] It is commonly referred to as multipurpose or Raufoss , meaning red waterfall in Norwegian.
On February 18, 2011, Intel announced that it would construct a new $5 billion semiconductor fabrication plant in Arizona, designed to manufacture chips using the "14 nm" manufacturing processes and leading-edge 300 mm wafers. [12] [13] The new fabrication plant was to be named Fab 42, and construction was meant to start in the middle of 2011 ...