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Uranium glass used as lead-in seals in a vacuum capacitor. Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of ...
The bonding between the glass or ceramics and the glass solder can be either covalent, or, more often, van der Waals. [12] The seal can be leak-tight; glass soldering is frequently used in vacuum technology. Glass solders can be also used as sealants; a vitreous enamel coating on iron lowered its permeability to hydrogen 10 times. [13]
When the brazing temperature is suitably high, brazing and heat treatment can be done in a single operation simultaneously. Eutectic alloys melt at single temperature, without mushy region. Eutectic alloys have superior spreading; non-eutectics in the mushy region have high viscosity and at the same time attack the base metal, with ...
The component is removed while the solder is molten, most easily by a spring-loaded puller attached to it before heating. Otherwise all joints must be freed from solder before the component can be removed. Each joint must be heated and the solder removed from it while molten using a vacuum pump, manual desoldering pump, or desoldering braid.
High-temperature. Brazing temperature 1870 °C. Can be used for brazing molybdenum. V 65 Nb 35: Nb 97.8 B 2.2 [5] – High-temperature. Can be used for brazing tungsten. 2.2: Nb 97.8: Nb 80 Ti 20 [5] – High-temperature. Can be used for brazing tungsten. 20: Nb 80: Pt 85 W 11 B 4 [5] – High-temperature. Joint remelt temperature 2200 °C. Can ...
Attachments can be made vertically, horizontally or even overhead. If preferred, threaded pins with nuts can be attached or cable bonded directly onto the pipe by means of a special cable lug which can be crimped on site or supplied complete as a unique integrally crimped attachment. The pin brazing unit contains all the equipment and tools ...
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When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used. High T g potting compounds may break solder bonds through solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part ...