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Thermal conduction is the diffusion of thermal energy (heat) within one material or between materials in contact. The higher temperature object has molecules with more kinetic energy; collisions between molecules distributes this kinetic energy until an object has the same kinetic energy throughout.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
In heat transfer, the thermal conductivity of a substance, k, is an intensive property that indicates its ability to conduct heat. For most materials, the amount of heat conducted varies (usually non-linearly) with temperature. [1] Thermal conductivity is often measured with laser flash analysis. Alternative measurements are also established.
A 2008 review paper written by Philips researcher Clemens J. M. Lasance notes that: "Although there is an analogy between heat flow by conduction (Fourier's law) and the flow of an electric current (Ohm’s law), the corresponding physical properties of thermal conductivity and electrical conductivity conspire to make the behavior of heat flow ...
The electrical resistivity of a metallic conductor decreases gradually as temperature is lowered. In normal (that is, non-superconducting) conductors, such as copper or silver, this decrease is limited by impurities and other defects. Even near absolute zero, a real sample of a normal conductor shows some resistance. In a superconductor, the ...
The process of heat transfer from one place to another place without the movement of particles is called conduction, such as when placing a hand on a cold glass of water—heat is conducted from the warm skin to the cold glass, but if the hand is held a few inches from the glass, little conduction would occur since air is a poor conductor of heat.
Thermal contact resistance is significant and may dominate for good heat conductors such as metals but can be neglected for poor heat conductors such as insulators. [2] Thermal contact conductance is an important factor in a variety of applications, largely because many physical systems contain a mechanical combination of two materials.
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance: