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A 2.5D integrated circuit (2.5D IC) is an advanced packaging technique [1] that combines multiple integrated circuit dies in a single package [2] without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs). [3] The term "2.5D" originated when 3D-ICs with TSVs were quite new and still very difficult.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
As with the standard op-amp, practical OTA's have some non-ideal characteristics. These include: Input stage non-linearity at higher differential input voltages due to the characteristics of the input stage transistors. In the early devices, such as the CA3080, the input stage consisted of two bipolar transistors connected in the differential ...
Clipper (electronics), a circuit that imposes a fixed limit and does not offset the signal; Envelope detector, a circuit that outputs the maximum (or minimum); a clamper with the diode and capacitor exchanged; Schottky diode; Snubber, a circuit that reduces dV/dt or limits peak voltage, in order to reduce arcing or breakdown
Reference voltage vs free-air temperature at test conditions. Design-center (middle plot) and worst-case deviation of ±2% (upper and lower plots) [12] The nominal reference voltage, V REF =2.495 V, stated in a datasheet, is tested in zener mode at an ambient temperature of +25 °C (77 °F), and I CA =10 mA. [13]
Although silicon's (Si) band gap at 0 K is technically 1.165 eV, the circuit essentially linearly extrapolates the bandgap–temperature curve [7] to determine a slightly higher but precise reference around 1.2–1.3 V (the specific value depends on the particular technology and circuit design); the remaining voltage change over the operating ...