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Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. [13] Low-temperature eutectic solder with high strength. [12] Particularly strong, very brittle. [11] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature
The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint. Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F). Extra-hard solder has 80% silver and melts at 740 °C (1,370 °F).
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.
Alloys with larger span of solidus/liquidus temperatures tend to melt through a "mushy" state, during which the alloy is a mixture of solid and liquid material. Some alloys show tendency to liquation, separation of the liquid from the solid portion; for these the heating through the melting range must be sufficiently fast to avoid this effect ...
Flux for hard soldering, used by silversmiths. Brazing (sometimes known as silver soldering or hard soldering) requires a higher temperature than soft soldering (> 450 °C). As well as removing existing oxides, rapid oxidation of the metal at the elevated temperatures has to be avoided.