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  2. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

  3. Distribution board - Wikipedia

    en.wikipedia.org/wiki/Distribution_board

    A distribution board (also known as panelboard, circuit breaker panel, breaker panel, electric panel, fuse box or DB box) is a component of an electricity supply system that divides an electrical power feed into subsidiary circuits while providing a protective fuse or circuit breaker for each circuit in a common enclosure.

  4. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

  5. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB; solder paste, which was previously applied to the pads, holds the components in place temporarily; if surface-mount components are applied to both sides of the board, the bottom-side ...

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. TAB: Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass

  7. Footprint (electronics) - Wikipedia

    en.wikipedia.org/wiki/Footprint_(electronics)

    Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board. A row of through-holes acting as the footprint for a pin header.. A footprint or land pattern is the arrangement of pads (in surface-mount technology) [1] or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.

  8. Electrical wiring - Wikipedia

    en.wikipedia.org/wiki/Electrical_wiring

    Electrical wiring is an electrical installation of cabling and associated devices such as switches, distribution boards, sockets, and light fittings in a structure. Wiring is subject to safety standards for design and installation.

  9. Land grid array - Wikipedia

    en.wikipedia.org/wiki/Land_grid_array

    LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]