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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Near "Tinman's solder", used for tinplate fabrication work. [28] Sn 63 Pb 37: 183 [57] Pb: Yes: Sn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of the most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics.
A number of solder materials, primarily zinc alloys, are used for soldering aluminium and alloys and to a lesser extent steel and zinc. This mechanical soldering is similar to a low temperature brazing operation, in that the mechanical characteristics of the joint are reasonably good and it can be used for structural repairs of those materials.
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Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K), [3] and is commonly used in electronics, plumbing, and sheet metal work.