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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, ... 3.05–3.6: 1.14–1.73 32-DIP: 15.24: 2.54 ...

  3. List of EC numbers (EC 5) - Wikipedia

    en.wikipedia.org/wiki/List_of_EC_numbers_(EC_5)

    EC 5.3.1.16: 1-(5-phosphoribosyl)-5-[(5-phosphoribosylamino)methylideneamino]imidazole-4-carboxamide isomerase EC 5.3.1.17 : 5-dehydro-4-deoxy- D -glucuronate isomerase EC 5.3.1.18 : deleted: reaction is due to EC 5.3.1.9 glucose-6-phosphate isomerase, in the presence of arsenate, or EC 5.3.1.5 xylose isomerase

  4. SCN5A - Wikipedia

    en.wikipedia.org/wiki/SCN5A

    SCN5A is a highly conserved gene [5] located on human chromosome 3, where it spans more than 100 kb. The gene consists of 28 exons, of which exon 1 and in part exon 2 form the 5' untranslated region and exon 28 the 3' untranslated region of the RNA.

  5. List of Intel processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_processors

    2.2 1.6 5.6 4.0 14 36 UHD 1650 32 55 157 FCBGA1964 Q1 2023 13950HX 5.5 13900HX 5.4 3.9 Iris Xe 13900HK 6 8 20 2.6 1.9 5.4 4.1 24 1500 96 45 115 FCBGA1744 13900H Core i7: 13850HX 8 12 28 2.1 1.5 5.3 3.8 14 30 UHD 1600 32 55 157 FCBGA1964 13700HX 8 24 5.0 3.6 1550 13650HX 6 8 20 2.6 1.9 4.9 11.5 24 16 13800H 2.5 1.8 5.2 4.0 Iris Xe 1500 96 45 115

  6. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Wafer size has grown over time, from 25 mm (1 inch) in 1960, to 50 mm (2 inches) in 1969, 100 mm (4 inches) in 1976, 125 mm (5 inches) in 1981, 150 mm (6 inches) in 1983 and 200 mm in 1992. [41] [42] In the era of 2-inch wafers, these were handled manually using tweezers and held manually for the time required for a given process.

  7. Transistor - Wikipedia

    en.wikipedia.org/wiki/Transistor

    [2] Physicist Julius Edgar Lilienfeld proposed the concept of a field-effect transistor (FET) in 1925, [ 3 ] but it was not possible to construct a working device at that time. [ 4 ] The first working device was a point-contact transistor invented in 1947 by physicists John Bardeen , Walter Brattain , and William Shockley at Bell Labs who ...

  8. Internal combustion engine - Wikipedia

    en.wikipedia.org/wiki/Internal_combustion_engine

    In crankcase scavenged 2-stroke engines, exhaust and intake are performed mostly simultaneously and with the combustion chamber at its maximum volume. The main advantage of 2-stroke engines of this type is mechanical simplicity and a higher power-to-weight ratio than their 4-stroke counterparts. Despite having twice as many power strokes per ...

  9. Phases of ice - Wikipedia

    en.wikipedia.org/wiki/Phases_of_ice

    To create ice XVII, the researchers first produced filled ice in a stable phase named C 0 from a mixture of hydrogen (H 2) and water (H 2 O), using temperatures from 100 to 270 K (−173 to −3 °C; −280 to 26 °F) and pressures from 360 to 700 MPa (52,000 to 102,000 psi; 3,600 to 6,900 atm), and C 2 are all stable solid phases of a mixture ...