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Manufacturing Engineers focus on the design, development, and operation of integrated systems of production to obtain high quality & economically competitive products. [2] These systems may include material handling equipment, machine tools, robots, or even computers or networks of computers.
An early example of a MEMS device is the resonant-gate transistor, an adaptation of the MOSFET, developed by Robert A. Wickstrom for Harvey C. Nathanson in 1965. [4] Another early example is the resonistor, an electromechanical monolithic resonator patented by Raymond J. Wilfinger between 1966 and 1971.
A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in
Both wafers and reticles can be handled by SMIF pods in a semiconductor fabrication environment. Used in lithographic tools, reticles or photomasks contain the image that is exposed on a coated wafer in one processing step of a complete integrated semiconductor manufacturing cycle. Because reticles are linked so directly with wafer processing ...
The idea of "digital manufacturing" became prominent in the early 1970s, with the release of Dr. Joseph Harrington's book, Computer Integrated Manufacturing. [5] However, it was not until 1984 when computer-integrated manufacturing began to be developed and promoted by machine tool manufacturers and the Computer and Automated Systems Association and Society of Manufacturing Engineers (CASA/SME).
Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs.
Material handling is integral to the design of most production systems since the efficient flow of material between the activities of a production system is heavily dependent on the arrangement (or layout) of the activities. If two activities are adjacent to each other, then material might easily be handed from one activity to another.
Pitch for a 300 mm FOUP is 10 mm, while 13 slot FOUPs can have a pitch up to 20 mm. The weight of a fully loaded 25 wafer FOUP is between 7 and 9 kilograms which means that automated material handling systems are essential for all but the smallest of fabrication plants.