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  2. Integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit

    A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. [1]

  3. Package on a package - Wikipedia

    en.wikipedia.org/wiki/Package_on_a_package

    In April 2007, Toshiba commercialized an eight-layer 3D chip package, the 16 GB THGAM embedded NAND flash memory chip, which was manufactured with eight stacked 2 GB NAND flash chips. [8] The same month, U.S. patent 7,923,830 ("Package-on-package secure module having anti-tamper mesh in the substrate of the upper package") was filed by Steven M ...

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is

  5. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.

  6. System in a package - Wikipedia

    en.wikipedia.org/wiki/System_in_a_package

    CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system.

  7. Multi-chip module - Wikipedia

    en.wikipedia.org/wiki/Multi-chip_module

    A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...

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