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ITX motherboard form factor comparison Comparison of the form factors for mini-ITX, mini-DTX, ATX, μATX and DTX motherboards. Mini-ITX is a 170 mm × 170 mm (6.7 in × 6.7 in) motherboard form factor developed by VIA Technologies in 2001. [1] Mini-ITX motherboards have been traditionally used in small-configured computer systems.
Comparison BTX μBTX nanoBTX ITX picoBTX BTX case of a Fujitsu Siemens Esprimo P2510 Clearly visible: the four holes for the "Support and Retention Module (SRM)". BTX (for Balanced Technology eXtended) is a form factor for motherboards, originally intended to be the replacement for the aging ATX motherboard form factor in late 2004 and early 2005.
Comparison of the form factors for motherboards ATX, μATX (micro-ATX), DTX, mini-ITX and mini-DTX The DTX form factor is a variation of ATX specification [ 1 ] designed especially for small form factor PCs (especially for HTPCs ) with dimensions of 8 × 9.6 inches (203 × 244 mm). [ 2 ]
Inside a gaming case during gameplay. 360° photograph. A full tower case. Accessories shown include: a fan controller, a DVD burner, and a USB memory card reader.. Cases can come in many different sizes and shapes, which are usually determined by the form factor of the motherboard since it is physically the largest hardware component in most computers. Consequently, personal computer form ...
The revealed socket Contacts of the Intel Core Ultra 9 285K (left; LGA 1851), and i9-14900K (right, Socket 1700) LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake-PS and Arrow Lake-S desktop processors, released in October 24, 2024. [1] The number of contacts has increased, from 1700 (for LGA 1700 ...
FlexATX is a motherboard form factor derived from ATX.The specification was released in 1999 by Intel as an addendum to the microATX specification. It uses a subset of the motherboard mounting holes required for microATX and the same I/O plate system as ATX and microATX.
A Mobile-ITX CPU module with an IO-board. Mobile-ITX is the smallest (by 2009) x86 compliant motherboard form factor presented by VIA Technologies in December, 2009. The motherboard size (CPU module) is 60 × 60 mm (2.4 × 2.4 in). [1] There are no computer ports on the CPU module and it is necessary to use an I/O carrier board. The design is ...
The Pico-ITXe specification adds onto the Pico-ITX form factor by taking the EPIA-P700 and upgrading the chipset to a VX800, doubling the maximum RAM to 2 GB, allowing for 667/533 SO-DIMM RAM, upgrading the GPU to VIA's Chrome9 HC3, and adding support for SUMIT. Another notable addition is the expansion from 10 to 12 layers thickness.