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  2. Bow and warp of semiconductor wafers and substrates

    en.wikipedia.org/wiki/Bow_and_warp_of...

    Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the reference plane, where the reference plane is defined by three corners of an equilateral triangle [clarification needed]. This definition is based on now obsolete ASTM F534. [1]