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  2. Land grid array - Wikipedia

    en.wikipedia.org/wiki/Land_grid_array

    LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder. Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.

  4. Abans - Wikipedia

    en.wikipedia.org/wiki/Abans

    Abans PLC also known as Abans Group is a Sri Lankan public limited company and a diversified conglomerate in Sri Lanka engaged in ICT, retail, manufacturing, logistics, commercial real estate and financial services. Abans predominantly functions mainly as a consumer retailer selling various electronic appliances, smart phones, laptops, cooking ...

  5. Pin grid array - Wikipedia

    en.wikipedia.org/wiki/Pin_grid_array

    Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...

  6. Embedded wafer level ball grid array - Wikipedia

    en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

    Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...

  7. Lanka Bell - Wikipedia

    en.wikipedia.org/wiki/Lanka_Bell

    It was the 3rd largest fixed wireless operator and the 3rd largest fixed phone operator with an island wide digital wireless network in Sri Lanka. Lanka Bell was formed in 1997 as the single largest BOI Company in Sri Lanka with an investment of over US$150 Million. It was subsequently acquired by the privately held diversified conglomerate ...

  8. Telecommunications in Sri Lanka - Wikipedia

    en.wikipedia.org/.../Telecommunications_in_Sri_Lanka

    Centre for Telecommunication Research is a research-based institute at the Sri Lanka Technological Campus (SLTC) to carry out innovative, collaborative and industry-sponsored research works in wireless communications and networking. Research activities at the CTR, both fundamental and applied, mainly focus on technologies related to the ...

  9. Dialog Axiata - Wikipedia

    en.wikipedia.org/wiki/Dialog_Axiata

    In 2005, Dialog Telekom launched the largest IPO seen by the Sri Lankan capital markets in an attempt to finance expanding the network. The Dialog Telekom initial offer, which was launched on a book building structure at a price range of LKR 8 to LKR 12 per share, consists of 712.3 million ordinary shares, which is a 9.6% stake of the company. [18]