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In materials science, a grain boundary is the interface between two grains, or crystallites, in a polycrystalline material. Grain boundaries are two-dimensional defects in the crystal structure, and tend to decrease the electrical and thermal conductivity of the material.
Figure 1: Hall–Petch strengthening is limited by the size of dislocations. Once the grain size reaches about 10 nanometres (3.9 × 10 −7 in), grain boundaries start to slide. In materials science, grain-boundary strengthening (or Hall–Petch strengthening) is a method of strengthening materials by changing their average crystallite (grain
Grain boundary sliding (GBS) is a material deformation mechanism where grains slide against each other. This occurs in polycrystalline material under external stress at high homologous temperature (above ~0.4 [1]) and low strain rate and is intertwined with creep.
A linear variation has been observed between twin thickness, stacking fault energy and grain size, [47] and to a lesser degree, the stress state of the twinning grain (Schmid Factor). [48] The twin thickness saturated once a critical residual dislocations’ density reached the coherent twin-parent crystal boundary. [33] [49]
A grain boundary is a single-phase interface, with crystals on each side of the boundary being identical except in orientation. The term "crystallite boundary" is sometimes, though rarely, used. Grain boundary areas contain those atoms that have been perturbed from their original lattice sites, dislocations , and impurities that have migrated ...
Grain boundary sliding is the process by which grains move to prevent separation at grain boundaries. [1] This process typically occurs on timescales significantly faster than that of mass diffusion (an order of magnitude quicker). Because of this, the rate of grain boundary sliding is typically irrelevant to determining material processes.
Zener pinning is the influence of a dispersion of fine particles on the movement of low- and high-angle grain boundaries through a polycrystalline material. Small particles act to prevent the motion of such boundaries by exerting a pinning pressure which counteracts the driving force pushing the boundaries.
Lower temperatures favor Coble creep and higher temperatures favor Nabbaro–Herring creep because the activation energy for vacancy diffusion within the lattice is typically larger than that along the grain boundaries, thus lattice diffusion slows down relative to grain boundary diffusion with decreasing temperature. [2]