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HyperOs Systems [11] England: No No No Yes No Imation [12] United States No No Formerly, but this company has exited the storage business. No No Intel [13] United States No Sold its NAND flash memory and SSD businesses to SK Hynix. Intel has terminated its Optane line of memory. Sold its NAND flash memory and SSD businesses to SK Hynix.
Historically, most SSDs used buses such as SATA, [19] SAS, [20] [21] or Fibre Channel for interfacing with the rest of a computer system. Since SSDs became available in mass markets, SATA has become the most typical way for connecting SSDs in personal computers; however, SATA was designed primarily for interfacing with mechanical hard disk drives (HDDs), and it became increasingly inadequate ...
Micron and Intel announced that they were producing their first 20 nm MLC NAND flash on April 14, 2011. [ 18 ] In February 2012, Intel launched the SSD 520 series solid state drives using the SandForce SF-2200 controller with sequential read and write speeds of 550 and 520 MB/s respectively with random read and write IOPS as high as 80,000.
Micron and Intel created a joint venture in 2005, based in IM Flash Technologies in Lehi, Utah. [15] The two companies formed another joint venture in 2011, IM Flash Singapore, in Singapore. [16] In 2012 Micron became sole owner of this second joint venture. [17] In 2006 Micron acquired Lexar, an American manufacturer of digital media products. [3]
3D XPoint (pronounced three-D cross point) is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and was available on the open market under the brand name Optane (Intel) from April 2017 to July 2022. [1]
NVM Express (NVMe): A modern interface designed specifically for SSDs, NVMe takes full advantage of the parallelism in SSDs, providing significantly lower latency and higher throughput than AHCI. [97] An M.2 (2242) solid-state-drive (SSD) connected into USB 3.0 adapter and connected to computer Mushkin Ventura, A USB that has an SSD inside
In 2016, Micron and Intel introduced a technology known as CMOS Under the Array/CMOS Under Array (CUA), Core over Periphery (COP), Periphery Under Cell (PUA), or Xtacking, [60] in which the control circuitry for the flash memory is placed under or above the flash memory cell array. This has allowed for an increase in the number of planes or ...
Shortly thereafter, in 2013, the JMF667 series was released as a 256 GB capacity, 512 MB DDR3 external cache SSD controller. [11] Analysis in 2013 reveals that SSD controller technology and high-speed transmission interface IC accounts for 29% and 67% of JMicron's sales, respectively. [2] In June 2014, JMicron announced the JMF670 and JMF670H.