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  2. Isophorone diamine - Wikipedia

    en.wikipedia.org/wiki/Isophorone_diamine

    Like other diamines or amines in general, it is a curing agent for epoxy resins. When used in coatings applications the higher cost compared to other amines is justified by the enhanced UV stability and thus lower yellowing tendency.

  3. B-staging - Wikipedia

    en.wikipedia.org/wiki/B-staging

    B-staging is a process that utilizes heat or UV light to remove the majority of solvent from an adhesive, thereby allowing a construction to be “staged”.In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance.

  4. Curing (chemistry) - Wikipedia

    en.wikipedia.org/wiki/Curing_(chemistry)

    An intermediate case involves a mixture of resin and additives that requires external stimulus (light, heat, radiation) to induce curing. The curing methodology depends on the resin and the application. Particular attention is paid to the shrinkage induced by the curing. Usually small values of shrinkage (2–3%) are desirable. [2]

  5. Epoxy - Wikipedia

    en.wikipedia.org/wiki/Epoxy

    The global epoxy resin market was valued at approximately $8 billion in 2016. The epoxy resin market is dominated by the Asia-Pacific region, which contributes 55.2% of the total market share. China is the major producer and consumer globally, consuming almost 35% of the global resin production.

  6. Pre-preg - Wikipedia

    en.wikipedia.org/wiki/Pre-preg

    The thermoset matrix is only partially cured to allow easy handling; this B-Stage material requires cold storage to prevent complete curing. B-Stage pre-preg is always stored in cooled areas since heat accelerates complete polymerization. Hence, composite structures built of pre-pregs will mostly require an oven or autoclave to cure.

  7. Wood glue - Wikipedia

    en.wikipedia.org/wiki/Wood_glue

    Epoxy resin, usually as a two-part mix system, cures under a wider range of temperatures and moisture content than other glues, does not require pressure while curing, and has good gap-filling properties: near-perfect joints with very small gaps actually produce weaker bonds. Use of epoxy requires careful attention to the mixing ratio of the ...