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In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer . [1] Curing is induced by heat or suitable radiation and may be promoted by high pressure or mixing with a catalyst.
The first batches of Araldite epoxy resins, for which the brand is best known, were made in Duxford, England in 1950. [1] Araldite adhesive sets by the interaction of an epoxy resin with a hardener. Mixing an epoxy resin and hardener together starts a chemical reaction that produces heat – an exothermic reaction. [2]
A hot glue gun loaded with a glue stick. Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun.
Curing can be induced by heat, radiation, electron beams, or chemical additives. To quote from IUPAC: curing "might or might not require mixing with a chemical curing agent". [1] Thus, two broad classes are curing induced by chemical additives (also called curing agents, hardeners) and curing in the absence of additives. An intermediate case ...
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.
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An epoxy may be used for mounting, but can lead to failure in the epoxy/polymer interface instead of in the bonded joint. [2] The most common method for testing solvent bonds is the tensile shear test using a lap joint configuration.