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To make vertical connections between interconnects on different levels, vias are used. The top-most layers of a chip have the thickest and widest and most widely separated metal layers, which make the wires on those layers have the least resistance and smallest RC time constant, so they are used for power and clock distribution networks. The ...
An instrument that provides highly magnified images by use of an electron beam. electronic amplifier A device that increases the power of an electrical signal by electronic means. electronic circuit A circuit using one or more electronic devices. electronic component An active or passive element of an electronic circuit. electronic control unit
The Invisible Internet Project (I2P) is an anonymous network layer (implemented as a mix network) that allows for censorship-resistant, peer-to-peer communication. Anonymous connections are achieved by encrypting the user's traffic (by using end-to-end encryption), and sending it through a volunteer-run network of roughly 55,000 computers distributed around the world.
The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15. The number is sometimes followed by a letter, indicating that components are grouped or matched with each other, e.g. R17A, R17B. The IEEE 315 standard contains a list of Class Designation Letters to use for electrical and electronic ...
Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same ...
It is used in switching power supplies in high-power applications: variable-frequency drives (VFDs) for motor control in electric cars, trains, variable-speed refrigerators, and air conditioners, as well as lamp ballasts, arc-welding machines, photovoltaic and hybrid inverters, uninterruptible power supply systems (UPS), and induction stoves.
IEC TR 61602 Connectors used in the field of audio, video and audiovisual engineering IEC 61603 Transmission of audio and/or video and related signals using infra-red radiation IEC TR 61604 Dimensions of uncoated ring cores of magnetic oxides (Withdrawn, replaced by IEC 62317-12:2016)
ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ...