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  2. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  3. Elevate (brand) - Wikipedia

    en.wikipedia.org/wiki/Elevate_(brand)

    Elevate, formerly Firestone Building Products, is a brand of roofing, wall and lining solutions of the Holcim Group, one of the world's largest building materials manufacturing company. Elevate operates 21 manufacturing facilities in North America and produces single–ply and asphalt–based roofing membranes, polyiso insulation, and roofing ...

  4. Carlisle Companies - Wikipedia

    en.wikipedia.org/wiki/Carlisle_Companies

    Carlisle Companies Incorporated is a supplier of construction products that make buildings more energy efficient and resilient. The company manufactures and sells single-ply roofing products as well as warranted systems and accessories for the commercial building industry.

  5. Pressure-sensitive adhesive - Wikipedia

    en.wikipedia.org/wiki/Pressure-sensitive_adhesive

    In contrast, pressure-sensitive adhesives (PSAs) form a bond simply by the application of light pressure to marry the adhesive with the adherend. Pressure-sensitive adhesives are designed with a balance between flow and resistance to flow. The bond forms because the adhesive is soft enough to flow, or wet, the adherend.

  6. Titanium adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Titanium_adhesive_bonding

    The pores and whiskers produced can be penetrated by selecting a low viscosity adhesive, like a 3M 1838 epoxide resin or an Epo-Tek 301 epoxy. The surface oxide can be compromised if it is subjected to high temperatures, above 300 °C, and humidity prior to bonding. [7] Pasa Jell wet and dry hone are chemical etchants produced by Semco.

  7. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

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