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A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to the other power semiconductor devices , such as an insulated-gate bipolar transistor (IGBT) or a thyristor , its main advantages are high switching speed and good efficiency at low voltages.
Test application time is fast since the vector sets are small. It catches some defects that other tests, particularly stuck-at logic tests, do not. Drawback: Compared to scan chain testing , Iddq testing is time consuming, and thus more expensive, as is achieved by current measurements that take much more time than reading digital pins in mass ...
Power MOSFETs with lateral structure are mainly used in high-end audio amplifiers and high-power PA systems. Their advantage is a better behaviour in the saturated region (corresponding to the linear region of a bipolar transistor) than the vertical MOSFETs. Vertical MOSFETs are designed for switching applications. [76]
A MOSFET requires fewer process steps and is therefore simpler and cheaper to manufacture (one diffusion doping step [3]: 87 compared to four for a bipolar process [3]: 50 ). Since there is no static gate current for a MOSFET, the power consumption of an integrated circuit based on MOSFETs can be lower.
LDMOS (laterally-diffused metal-oxide semiconductor) [1] is a planar double-diffused MOSFET (metal–oxide–semiconductor field-effect transistor) used in amplifiers, including microwave power amplifiers, RF power amplifiers and audio power amplifiers. These transistors are often fabricated on p/p + silicon epitaxial layers.
In field-effect transistors (FETs), depletion mode and enhancement mode are two major transistor types, corresponding to whether the transistor is in an on state or an off state at zero gate–source voltage. Enhancement-mode MOSFETs (metal–oxide–semiconductor FETs) are the common switching elements in most integrated circuits.
The IGBT (insulated-gate bipolar transistor) is a device for power control. It has a structure akin to a MOSFET coupled with a bipolar-like main conduction channel. These are commonly used for the 200–3000 V drain-to-source voltage range of operation. Power MOSFETs are still the device of choice for drain-to-source voltages of 1 to 200 V.
The MOSFETs are n-type enhancement mode transistors, arranged in a so-called "pull-down network" (PDN) between the logic gate output and negative supply voltage (typically the ground). A pull up (i.e. a "load" that can be thought of as a resistor, see below) is placed between the positive supply voltage and each logic gate output.