Ad
related to: stress migration vs electromigration class 8 worksheet
Search results
Results From The WOW.Com Content Network
Stress migration is a failure mechanism that often occurs in integrated circuit metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance.
Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
It gives the contact stress as a function of the normal contact force, the radii of curvature of both bodies and the modulus of elasticity of both bodies. Hertzian contact stress forms the foundation for the equations for load bearing capabilities and fatigue life in bearings, gears, and any other bodies where two surfaces are in contact.
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
Feedback-controlled electromigration (FCE) is an experimental technique to investigate the phenomenon known as electromigration. By controlling the voltage applied as the conductance varies it is possible to keep the voltage at a critical level for electromigration .
Grain boundary sliding (GBS) is a material deformation mechanism where grains slide against each other. This occurs in polycrystalline material under external stress at high homologous temperature (above ~0.4 [1]) and low strain rate and is intertwined with creep.
The nominal stress = is the transpose of the first Piola–Kirchhoff stress (PK1 stress, also called engineering stress) and is defined via = = = or = = = This stress is unsymmetric and is a two-point tensor like the deformation gradient.
A stress profile is developed and applied to the UUT. The profile simulates the environmental conditions encountered during transportation, storage, handling, and operational use phases. The UUT is configured to match the phase, e.g. transportation shocks are applied with the UUT in the shipping container, operational use temperature cycles are ...