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Stress migration is a failure mechanism that often occurs in integrated circuit metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance.
Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
Feedback-controlled electromigration (FCE) is an experimental technique to investigate the phenomenon known as electromigration. By controlling the voltage applied as the conductance varies it is possible to keep the voltage at a critical level for electromigration .
Grain boundary sliding (GBS) is a material deformation mechanism where grains slide against each other. This occurs in polycrystalline material under external stress at high homologous temperature (above ~0.4 [1]) and low strain rate and is intertwined with creep.
Experimentally, stress relaxation is determined by step strain experiments, i.e. by applying a sudden one-time strain and measuring the build-up and subsequent relaxation of stress in the material (see figure), in either extensional or shear rheology. a) Applied step strain and b) induced stress as functions of time for a viscoelastic material.
The nominal stress = is the transpose of the first Piola–Kirchhoff stress (PK1 stress, also called engineering stress) and is defined via = = = or = = = This stress is unsymmetric and is a two-point tensor like the deformation gradient.
In fracture mechanics, the energy release rate, , is the rate at which energy is transformed as a material undergoes fracture.Mathematically, the energy release rate is expressed as the decrease in total potential energy per increase in fracture surface area, [1] [2] and is thus expressed in terms of energy per unit area.