Search results
Results From The WOW.Com Content Network
Stress migration is a failure mechanism that often occurs in integrated circuit metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance.
Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
Grain boundary sliding (GBS) is a material deformation mechanism where grains slide against each other. This occurs in polycrystalline material under external stress at high homologous temperature (above ~0.4 [1]) and low strain rate and is intertwined with creep.
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
Feedback-controlled electromigration (FCE) is an experimental technique to investigate the phenomenon known as electromigration. By controlling the voltage applied as the conductance varies it is possible to keep the voltage at a critical level for electromigration .
The nominal stress = is the transpose of the first Piola–Kirchhoff stress (PK1 stress, also called engineering stress) and is defined via = = = or = = = This stress is unsymmetric and is a two-point tensor like the deformation gradient.
Representative curves of applied stress vs number of cycles for steel (showing an endurance limit) and aluminium (showing no such limit).. The fatigue limit or endurance limit is the stress level below which an infinite number of loading cycles can be applied to a material without causing fatigue failure. [1]
Engineering stress and engineering strain are approximations to the internal state that may be determined from the external forces and deformations of an object, provided that there is no significant change in size. When there is a significant change in size, the true stress and true strain can be derived from the instantaneous size of the object.