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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. TO-3: Panel-mount with leads; TO-5: Metal can package with radial leads; TO-18: Metal can package with radial leads; TO-39; TO-46; TO-66: Similar shape to the TO-3 but smaller
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [ 1 ] SOT23-5 differs from SOT23 in a wider body of 1.6 mm (0.063 in) instead of 1.3 mm (0.051 in).
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.
The 2N3904 is an NPN transistor that can only switch one-third the current of the 2N2222 but has otherwise similar characteristics. The 2N3904 exhibits its forward gain (beta) peak at a lower current than the 2N2222, and is useful in amplifier applications with reduced I c , e.g., (gain peak at 10 mA for the 2N3904 but 150 mA for the 2N2222).
Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery.
Listed are many semiconductor scale examples for various metal–oxide–semiconductor field-effect transistor (MOSFET, or MOS transistor) semiconductor manufacturing process nodes. Timeline of MOSFET demonstrations
Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.