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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
Coherent, Inc., headquartered in Santa Clara, California is an American company that develops, manufactures and supports laser equipment and related specialty components. . Coherent was founded in May 1966 by physicist James Hobart and five cofound
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Direct metal laser sintering [4] Filament winding, produces composite pipes, tanks, etc. [3] Fused deposition modeling [3] Inkjet Printing [5] Laminated object manufacturing [3] Laser engineered net shaping [3] Layered manufacturing [3] Rapid Induction Printing; Selective laser sintering [3] Spark plasma sintering; Stereolithography [3]
Laser soldering is a technique where a 30–50 W laser is used to melt and solder an electrical connection joint. Diode laser systems based on semiconductor junctions are used for this purpose. [21] Suzanne Jenniches patented laser soldering in 1980. [22] Wavelengths are typically 808 nm through 980 nm. The beam is delivered via an optical ...
Sensors installed to a fixture to check selective solder machine parameters Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.
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