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There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
The term "Three-Dimensional Printing" was trademarked by the research group at MIT, along with the abbreviation 3DP. [ 5 ] [ 6 ] As a result, the term "3D printing" originally referred uniquely to the binder jet printing process prior to gaining wider acceptance as a term referring to all additive manufacturing processes.
3D printing, or additive manufacturing, is the construction of a three-dimensional object from a CAD model or a digital 3D model. [1] [2] [3] It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, [4] with the material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer.
A single Promontory 21 chip provides four SATA III ports and twelve PCIe 4.0 lanes. Four lanes are reserved for the chipset uplink to the CPU while another four are used to connect to another Promontory 21 chip in a daisy-chained topology for X670, X670E and X870E chipsets. [50]
Both the MARIO CHIP 1 and the GSU-1 can support a maximum ROM size of 8 Mbits. The design was revised to the GSU-2, which is still 16-bit, but this version can support a ROM size greater than 8 Mbit. The final known revision is the GSU-2-SP1. All versions of the Super FX chip are functionally compatible in terms of their instruction set.
For example, in memory chip fabrication there are some 30 lithography steps, 10 oxidation steps, 20 etching steps, 10 doping steps, and many others are performed. The complexity of microfabrication processes can be described by their mask count.
WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices. However, the vast majority of DIPs are manufactured via a thermoset molding process in which an epoxy mold compound is heated and transferred under ...