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  2. Wafering - Wikipedia

    en.wikipedia.org/wiki/Wafering

    Wafering is the process by which a silicon crystal is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.

  3. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots up to 300 mm (slightly less than 12 inches) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75 mm thick and polished to obtain a very regular and flat surface.

  4. Buttercream - Wikipedia

    en.wikipedia.org/wiki/Buttercream

    Mock cream or buttercream is a simple buttercream made by creaming together butter and powdered sugar to the desired consistency and lightness. Some or all of the butter can be replaced with margarine, or shortening. [1] [2] A small amount of milk or cream is added to adjust the texture. Usually twice as much sugar as butter by weight is used.

  5. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...

  6. How to Make Cream Cheese Frosting - AOL

    www.aol.com/lifestyle/food-how-make-cream-cheese...

    Buttercream frosting is typically made with powdered sugar, butter and vanilla extract or another flavoring. Sometimes salt and milk or heavy cream can be added. Sometimes salt and milk or heavy ...

  7. Chip on board - Wikipedia

    en.wikipedia.org/wiki/Chip_on_board

    Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy [4] or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly ...

  8. Immersion lithography - Wikipedia

    en.wikipedia.org/wiki/Immersion_lithography

    By using a liquid with a higher refractive index than air, immersion lithography allows for smaller features to be created on the wafer. [1] Immersion lithography replaces the usual air gap between the final lens and the wafer surface with a liquid medium that has a refractive index greater than one.

  9. Piranha solution - Wikipedia

    en.wikipedia.org/wiki/Piranha_solution

    Piranha solution is used frequently in the microelectronics industry, e.g. to clean photoresist or organic material residue from silicon wafers. It is also widely employed in wet etching of wafers in the semiconductor fabrication process. [1]