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  2. Electrical conduit - Wikipedia

    en.wikipedia.org/wiki/Electrical_conduit

    Surface mounted raceway (wire molding) [ edit ] This type of "decorative" conduit is designed to provide an aesthetically acceptable passageway for wiring without hiding it inside or behind a wall.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

  5. Thin shrink small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_Shrink_Small_Outline...

    The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. Application

  6. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by small-outline integrated circuit—a carrier which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less. [6]

  7. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    At the outside of the package, wire leads may be soldered to a printed circuit board or used to secure the device to a tag strip. Modern surface mount devices eliminate most of the drilled holes through circuit boards, and have short metal leads or pads on the package that can be secured by oven-reflow soldering.