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  2. Socket AM4 - Wikipedia

    en.wikipedia.org/wiki/Socket_AM4

    [3] [4] In 2017, AMD made a commitment to using the AM4 platform with socket 1331 until 2020. [5] [6] [7] AM5 succeeded the AM4 platform in late 2022 with the introduction of the Ryzen 7000 series, however, AMD has continued to release new CPUs for AM4 even after the release of AM5. [8] [9] [10] [11]

  3. Template:AM4 chipsets - Wikipedia

    en.wikipedia.org/wiki/Template:AM4_chipsets

    Model Release date PCIe support [a] Multi-GPU USB support [b] Storage features Processor overclocking TDP CPU support Architecture Part number CrossFire SLI SATA ports RAID AMD StoreMI

  4. Ryzen - Wikipedia

    en.wikipedia.org/wiki/Ryzen

    Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən / RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture.

  5. Socket TR4 - Wikipedia

    en.wikipedia.org/wiki/Socket_TR4

    Socket TR4, also known as Socket SP3r2, is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, [1] [2] launched on August 10, 2017 [3] for the high-end desktop and workstation platforms.

  6. Radeon RX Vega series - Wikipedia

    en.wikipedia.org/wiki/Radeon_RX_Vega_series

    Common features of Zen based Raven Ridge desktop APUs: Socket: AM4. All the CPUs support DDR4-2666 (DDR4-2933 Ryzen) in dual-channel mode. L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: GlobalFoundries ...

  7. Zen 3 - Wikipedia

    en.wikipedia.org/wiki/Zen_3

    The Epyc server line of chips based on Zen 3 is named Milan and is the final generation of chips using the SP3 socket. [6] Epyc Milan was released on March 15, 2021. [65] Common features: SP3 socket; Zen 3 microarchitecture; TSMC 7 nm process for the compute and cache dies, GloFo 14 nm process for the I/O die

  8. The Dow's Big Shift and the Next Generation of Big Oil - AOL

    www.aol.com/2013/03/17/the-dows-big-shift-and...

    The Dow Jones Industrial Average made a big change on March 17, 1997. Four companies exited that no longer exist in the same form today -- Texaco (absorbed), Woolworth (changed name and business.

  9. Waterborne resins - Wikipedia

    en.wikipedia.org/wiki/Waterborne_resins

    Most coatings have four basic components. These are the resin, solvent, pigment and additive systems [5] but the resin or binder is the key ingredient. Continuing environmental legislation in many countries along with geopolitics such as oil production are ensuring that chemists are increasingly turning to waterborne technology for paint/coatings and since resins or binders are the most ...