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Charge carrier density, also known as carrier concentration, denotes the number of charge carriers per volume. In SI units, it is measured in m −3. As with any density, in principle it can depend on position. However, usually carrier concentration is given as a single number, and represents the average carrier density over the whole material.
Doping of a pure silicon array. Silicon based intrinsic semiconductor becomes extrinsic when impurities such as boron and antimony are introduced.. In semiconductor production, doping is the intentional introduction of impurities into an intrinsic (undoped) semiconductor for the purpose of modulating its electrical, optical and structural properties.
While there is considerable scatter in the experimental data, for noncompensated material (no counter doping) for heavily doped substrates (i.e. and up), the mobility in silicon is often characterized by the empirical relationship: [37] = + + where N is the doping concentration (either N D or N A), and N ref and α are fitting parameters.
An extrinsic semiconductor is one that has been doped; during manufacture of the semiconductor crystal a trace element or chemical called a doping agent has been incorporated chemically into the crystal, for the purpose of giving it different electrical properties than the pure semiconductor crystal, which is called an intrinsic semiconductor.
Silicon wafers are generally not 100% pure silicon, but are instead formed with an initial impurity doping concentration between 10 13 and 10 16 atoms per cm 3 of boron, phosphorus, arsenic, or antimony which is added to the melt and defines the wafer as either bulk n-type or p-type. [27]
Specialized doping techniques like core doping, pill doping, gas doping and neutron transmutation doping are used to incorporate a uniform concentration of desirable impurity. Float-zone silicon wafers may be irradiated by neutrons to turn it into a n-doped semiconductor.
10. Using a conventional doping process, or a process called ion-implantation, the source, drain and the polysilicon are doped. The thin oxide under the silicon gate acts as a mask for the doping process. This step is what makes the gate self-aligning. The source and drain regions are automatically properly aligned with the (already in place ...
The resistivity, mobility, and free-carrier concentration in monocrystalline silicon vary with doping concentration of the single crystal silicon. Whereas the doping of polycrystalline silicon does have an effect on the resistivity, mobility, and free-carrier concentration, these properties strongly depend on the polycrystalline grain size ...