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304-pin plastic quad flat package (QFP) with exposed thermal pad (TP) ... 0.8 mm, and 1.0 mm. PQFP, or plastic quad flat pack, is a type of QFP, as is the thinner ...
Quad flat package : various sizes, with pins on all four sides Low-profile quad flat-package ( LQFP ): 1.4 mm high, varying sized and pins on all four sides Plastic quad flat-pack ( PQFP ), a square with pins on all four sides, 44 or more pins
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology , one of several package technologies that connect ICs to the ...
In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline packages (TSOP) replaced PGA packages as the most common for high pin count devices, [1] though PGA packages are still often used for microprocessors. However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8]
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The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and ...