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A 1,300,000-square-foot (120,000 m 2) complex of mixed residential, office, retail and commercial space is being built on 15 acres (61,000 m 2) of former industrial land in downtown Victoria that was contaminated by lead. 10 tonnes of soil was treated with cement, which was mixed into the soil on site simply by using an excavator bucket. The ...
A binder or binding agent is any material or substance that holds or draws other materials together to form a cohesive whole mechanically, chemically, by adhesion or cohesion. More narrowly, binders are liquid or dough-like substances that harden by a chemical or physical process and bind fibres, filler powder and other particles added into it.
Calcium silicate hydrate (also shown as C-S-H) is a result of the reaction between the silicate phases of Portland cement and water. This reaction typically is expressed as: 2 Ca 3 SiO 5 + 7 H 2 O → 3 CaO · 2 SiO 2 · 4 H 2 O + 3 Ca(OH) 2 + 173.6 kJ. also written in cement chemist notation, (CCN) as: 2 C 3 S + 7 H → C 3 S 2 H 4 + 3 CH + heat
To attempt to simplify and to stylize a very complex set of various reactions, the whole ASR reaction, after its complete evolution (ageing process) in the presence of sufficient Ca 2+ cations available in solution, could be compared to the pozzolanic reaction which would be catalysed by the undesirable presence of excessive concentrations of alkali hydroxides (NaOH and KOH) in the concrete.
A release agent (also mold release agent, release coating, or mold release coating) is a chemical used to prevent other materials from bonding to surfaces. Release agents aid in processes involving mold release, die-cast release, plastic release, adhesive release, and tire and web release. [ 1 ]
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.
Detlef Symietz, Andreas Lutz: Structural bonding in vehicle construction. Properties, applications and performance of a new joining process. (= The Library of Technology, Volume 291). Verlag Moderne Industrie, 2006, ISBN 3-937-88955-8. DIN 2304-1 Adhesive Technology - Quality Requirements for Adhesive Processes. Part 1: Process Chain.
The decrease of temperature is based on the increase of bonding strength using plasma activation on clean wafer surfaces. Further, the increase is caused by elevation in amount of Si-OH groups, removal of contaminants on the wafer surface, the enhancement of viscous flow of the surface layer and the enhanced diffusivity of water and gas trapped at the interface. [2]