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  2. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete.

  3. Etching - Wikipedia

    en.wikipedia.org/wiki/Etching

    Etching is traditionally the process of using strong acid or mordant to cut into the unprotected parts of a metal surface to create a design in intaglio (incised) in the metal. [1] In modern manufacturing, other chemicals may be used on other types of material.

  4. Chemical milling - Wikipedia

    en.wikipedia.org/wiki/Chemical_milling

    Chemical milling or industrial etching is the subtractive manufacturing process of using baths of temperature-regulated etching chemicals to remove material to create an object with the desired shape. [1] [2] Other names for chemical etching include photo etching, chemical etching, photo chemical etching and photochemical machining. It is ...

  5. Photochemical machining - Wikipedia

    en.wikipedia.org/wiki/Photochemical_machining

    Photochemical etching (center), compared to reactive ion etching (bottom) Photochemical machining (PCM), also known as photochemical milling or photo etching, is a chemical milling process used to fabricate sheet metal components using a photoresist and etchants to corrosively machine away selected areas. This process emerged in the 1960s as an ...

  6. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...

  7. Reactive-ion etching - Wikipedia

    en.wikipedia.org/wiki/Reactive-ion_etching

    Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching . RIE uses chemically reactive plasma to remove material deposited on wafers .

  8. Deep reactive-ion etching - Wikipedia

    en.wikipedia.org/wiki/Deep_reactive-ion_etching

    To etch through a 0.5 mm silicon wafer, for example, 100–1000 etch/deposit steps are needed. The two-phase process causes the sidewalls to undulate with an amplitude of about 100–500 nm. The cycle time can be adjusted: short cycles yield smoother walls, and long cycles yield a higher etch rate.

  9. Bulk micromachining - Wikipedia

    en.wikipedia.org/wiki/Bulk_micromachining

    Bulk micromachining [1] is a process used to produce micromachinery or microelectromechanical systems (MEMS).. Unlike surface micromachining, which uses a succession of thin film deposition and selective etching, bulk micromachining defines structures by selectively etching inside a substrate.