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In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits. Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates.
Glitch removal is the elimination of glitches—unnecessary signal transitions without functionality—from electronic circuits. Power dissipation of a gate occurs in two ways: static power dissipation and dynamic power dissipation. Glitch power comes under dynamic dissipation in the circuit and is directly proportional to switching activity.
Includes many practical applications, problems and examples emphasizing troubleshooting, design, and safety to provide a solid foundation in the field of electronics. Assuming that readers have a basic understanding of algebra and trigonometry , the book provides a thorough treatment of the basic principles, theorems , circuit behavior and ...
The individual circuits are then connected together in a particular arrangement that depends upon the type of fault being studied (this can be found in most power systems textbooks). Once the sequence circuits are properly connected, the network can then be analyzed using classical circuit analysis techniques.
For each signal event, decide how to excite the circuit so that the noise event will occur. Create a SPICE (or another circuit simulator) netlist that represents the desired excitation, to include as many effects (such as parasitic inductance and capacitance, and various distortion effects) as necessary. Run SPICE simulations.
A simple example of an effectively random cause in a physical system is a borderline electrical connection in the wiring or a component of a circuit, where (cause 1, the cause that must be identified and rectified) two conductors may touch subject to (cause 2, which need not be identified) a minor change in temperature, vibration, orientation ...
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
In electronics this often is the result of components that are thermally sensitive (since resistance of a circuit varies with the temperature of the conductors in it). Compressed air can be used to cool specific spots on a circuit board and a heat gun can be used to raise the temperatures; thus troubleshooting of electronics systems frequently ...