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  2. Comparison of memory cards - Wikipedia

    en.wikipedia.org/wiki/Comparison_of_memory_cards

    Same build as SD/SDHC, but greater capacity and transfer speed, 32 GB and higher. Standard goes up to 2 TB (not compatible with older host devices). microSDXC: 2009 2 TB [6] Same build as microSD/microSDHC, but greater capacity and transfer speed, 32 GB and higher. Standard goes up to 2 TB (not compatible with older host devices). SDUC: 2018

  3. SD card - Wikipedia

    en.wikipedia.org/wiki/SD_card

    In January 2018, Integral Memory unveiled its 512 GB microSDXC card. [50] In May 2018, PNY launched a 512 GB microSDXC card. In June 2018 Kingston announced its Canvas series of microSD cards which were capable of capacities up to 512 GB, [d] in three variations, Select, Go! and React. [51]

  4. MultiMediaCard - Wikipedia

    en.wikipedia.org/wiki/MultiMediaCard

    The RS-MMC uses a simple mechanical adapter to elongate the card so it can be used in any MMC (or SD) slot. RS-MMCs are currently available in sizes up to and including 2 GB. The modern continuation of an RS-MMC is commonly known as MiniDrive (MD-MMC). A MiniDrive is generally a microSD card adapter in the RS-MMC form factor.

  5. Memory card - Wikipedia

    en.wikipedia.org/wiki/Memory_card

    Standard SD UFS Card CFast XQD CFexpress; Version 3.0 4.0 6.0 7.0 [28]: 8.0 1.0 2.0 1.0 2.0 1.0 2.0 1.0 2.0 4.0 Launched 2010 Q2 2011 Q1 2017 Q1 2018 Q2 2020 Q1

  6. Universal Flash Storage - Wikipedia

    en.wikipedia.org/wiki/Universal_Flash_Storage

    The electrical interface for UFS uses the M-PHY, [6] developed by the MIPI Alliance, a high-speed serial interface targeting 2.9 Gbit/s per lane with up-scalability to 5.8 Gbit/s per lane. [7] [8] UFS implements a full-duplex serial LVDS interface that scales better to higher bandwidths than the 8-lane parallel and half-duplex interface of eMMCs.

  7. Flash memory - Wikipedia

    en.wikipedia.org/wiki/Flash_memory

    As of August 2017, microSD cards with a capacity up to 400 GB (400 billion bytes) are available. [65] [66] The same year, Samsung combined 3D IC chip stacking with its 3D V-NAND and TLC technologies to manufacture its 512 GB KLUFG8R1EM flash memory package with eight stacked 64-layer V-NAND chips. [8]