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Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).
Arctic Alumina is a ceramics-based polysynthetic thermal compound using aluminum oxide as a thermal transfer medium. It is a lower-cost product than Arctic Silver 5. [1] The 2009 BenchmarkReviews.com 80-product review rated Alumina in the Good class, with a B+ "enthusiast grade"; [2] it cooled a test system 10% better than the last-place finisher.
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
Arctic GmbH, formerly known as Arctic Cooling, [1] is a German, Swiss-founded manufacturer of computer cooling components, mainly CPU and graphics card coolers, [2] case fans and thermal compound. Since 2010, Arctic expanded its business by starting a range of products to cater other consumer demands beyond that of computer cooling hardware.
Very high thermal conductivity measurements up to 22,600 w m −1 K −1 were reported by Fenton, E.W., Rogers, J.S. and Woods, S.D. in reference 570 on page 1458, 41, 2026–33, 1963. The data is listed on pages 6 through 8 and graphed on page 1 where Fenton and company are on curves 63 and 64.
Properly applied thermal interface materials displace the air that is present in the gaps between the two objects with a material that has a much-higher thermal conductivity. Air has a thermal conductivity of 0.022 W/(m·K) [19] while TIMs have conductivities of 0.3 W/(m·K) [20] and higher. When selecting a TIM, care must be taken with the ...
As quoted from various sources in an online version of: David R. Lide (ed), CRC Handbook of Chemistry and Physics, 84th Edition.CRC Press. Boca Raton, Florida, 2003; Section 12, Properties of Solids; Thermal and Physical Properties of Pure Metals / Thermal Conductivity of Crystalline Dielectrics / Thermal Conductivity of Metals and Semiconductors as a Function of Temperature
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.