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Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...
Plastic small-outline package [3] PSON: Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is 0.635 mm. [3] SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3 ...
The first plastic made from synthetic components, it was developed by Leo Baekeland in Yonkers, New York, in 1907, and patented on December 7, 1909. [ 3 ] Bakelite was one of the first plastic-like materials to be introduced into the modern world and was popular because it could be moulded and then hardened into any shape.
Formica Laminate is a laminated composite material invented at the Westinghouse Electric Corporation in the United States in 1912. Originally used to replace mica in electrical applications, it has since been manufactured for multiple applications. It has been produced by Formica Group manufacturing sites across the globe since.
Molded plastic cases and structural parts can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly. Examples are injection molding, transfer molding, vacuum forming, and die cutting. Pl can be post-processed to provide conductive surfaces.
Lead softens the plastic and makes it more flexible so that it can go back to its original shape. Habitual chewing on colored plastic insulation from stripped electrical wires was found to cause elevated lead levels in a 46-year-old man. [298] Lead may be used in plastic toys to stabilize molecules from heat.
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A lead frame has two sections: a die paddle, where the die sits in the leadframe, and the leads. The leadframe is made of an alloy the molding compound can adhere to, a thermal expansion coefficient that is as close as possible to that of the die and compound, has good thermal and electrical conductivity, is strong enough and has high formability.