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A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 banks for each bank group for ×16 DRAM. The DDR4 SDRAM uses an 8n prefetch architecture to achieve high-speed
DDR4 reached mass market adoption around 2015, which is comparable with the approximately five years taken for DDR3 to achieve mass market transition over DDR2. The DDR4 chips run at 1.2 V or less, [18] [19] compared to the 1.5 V of DDR3 chips, and have in excess of 2 billion data transfers per second.
up to 64 GB DDR4-2133 non-ECC 32 GB DDR4-2133 ECC (Xeon) (2 slots) Intel HD 630 or Intel HD P630 (Xeon) optional NVIDIA Quadro M1200M (4 GB GDDR5) two M.2 2280 drive or one M.2 with 92 Wh battery Intel I219-LM Gigabit Ethernet Intel Wireless-AC 8265 (802.11ac Bluetooth 4.2) WLAN: 15.6" WLED FHD 600:1 300nits UWVA or WLED FHD 600:1 300nits UWVA ...
On July 5, 2006, Samsung announced the mass-production of 32-bit 512-Mbit GDDR4 SDRAM rated at 2.4 Gbit/s per pin, or 9.6 GB/s for the module. Although designed to match the performance of XDR DRAM on high-pin-count memory, it would not be able to match XDR performance on low-pin-count designs.
DDR2 and DDR3 increased this factor to 4× and 8×, respectively, delivering 4-word and 8-word bursts over 2 and 4 clock cycles, respectively. The internal access rate is mostly unchanged (200 million per second for DDR-400, DDR2-800 and DDR3-1600 memory), but each access transfers more data.